Inkqubo yokuvelisa isibane sePC

Inkqubo yokuvelisa isibane sePC

Inkqubo yokuvelisa isibane sePC

IiLampshades zizinto ezixhaphakileyo kubomi bemihla ngemihla. Izinto ezisetyenziselwa iiPC lampshades zizinto zePC ezisasazekileyo/izinto zePMMA. Singazenza zombini ezi zinto zimbini. Sinamava angaphezu kweminyaka eli-17 ekwenzeni isikhunta kwaye sinama-lampshades angaphezu kwe-100. Oku kulandelayo yinkqubo yokuvelisa iilampshades.

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1. Uhlalutyo lweemfuno kunye noyilo lwedijithali

Imodeli yokusebenza kwe-Optical

Ukulinganisa ukukhanya: Sebenzisa i-LightTools okanye i-Zemax OpticStudio ukuze umisele imodeli yendlela yokukhanya ukuqinisekisa ukuba ukuhanjiswa kokukhanya kwesibane se-lampshade yi-≥92% (iimpawu zezinto zePC) kwaye uphephe ukukhanya okuqaqambileyo (UGR<19);

Ukuqinisekiswa kolwakhiwo: Sebenzisa i-topology ye-ANSYS ukuze ulungise ubukhulu bodonga lwesikhunta (oluqhelekileyo yi-1.5-3mm), ukulinganisela ukukhaphukhaphu kunye nokumelana nempembelelo (olukwaziyo ukumelana nempembelelo yebhola yokuwa eyi-3kg).

Uyilo lwe-3D lwezibumba

Icebo lokuchwetheza: Kwiindawo ezintsonkothileyo (ezifana neepateni zeFresnel), imigca yokuchwetheza engalinganiyo iyasetyenziswa, idityaniswe nendlela yokudibanisa intonga yesilayidi esinemilinganiselo emithathu (ukunyamezelana kwe-angular ±0.01°);

Ukupholisa okucwangcisiweyo: Imijelo yamanzi ye-titanium alloy eprintiweyo ye-3D (ububanzi obuyi-1.2-2mm) iqinisekisa ukuba ubushushu bokubumba buyi-≤±1.5℃, nto leyo ethintela ukumhlophe koxinzelelo lwezinto zePC.

 

2. Ukulungiswa komatshini kunye nonyango lomphezulu ngokuchanekileyo

Itekhnoloji engundoqo:

Umatshini wokugaya iiCavity, umatshini wokuchaneka kakhulu we-axis ezintlanu (i-GF Machining Solutions), uburhabaxa bomphezulu i-Ra≤0.02μm

Ukukrola isakhiwo esincinci, i-laser ye-femtosecond + inkqubo ye-nanoimprint edibeneyo, ubunzulu beFresnel 0.05mm±0.003mm

Ukucutshungulwa kwee-electrode, ukucutshungulwa kombane kwee-electrode ze-graphite (umsantsa wokukhupha umbane yi-0.03mm), umphetho we-R Angle ≤0.1mm

Unyango lokuqinisa umphezulu

Ukupholisha nge-optical-grade: Ukupholisha nge-multi-stage nge-diamond gypsum (ukusuka kwi-W40 ukuya kwi-W0.5), kudityaniswe nokupholisha nge-magnetorheological (MRF) ukuze kupheliswe umonakalo ongaphantsi komhlaba;

Ukwaleka okunamathelayo: Ukwaleka okufana nedayimani (i-DLC) (enobukhulu obuyi-2-3μm) kunciphisa amandla okukhupha ukuya kwi-<5kN kwaye kwandisa ubomi bokwaleka ukuya kwi-800,000 molds

 

3. Ukuqinisekiswa kwesilingo sokubumba kunye nokwenza ngcono imveliso ngobuninzi

Ifestile yenkqubo yokubumba ngenaliti

Ulawulo lobushushu: Ubushushu bebhareli 280-310℃ (i-PC melt index 18g/10min), ubushushu bokubumba 90-110℃ (ukuthintela ukukrweleka kwezinto ezibandayo);

Ijika loxinzelelo: Ukubamba uxinzelelo olunezigaba ezintathu (60MPa→45MPa→30MPa), izinga lokunciphisa imbuyekezo yi-0.6-0.8%.

 

Ukulungiswa kwe-closed-loop egqibeleleyo

Umgca we-weld uyaphuhliswa kwaye indawo yesango ayifanelekanga, nto leyo ebangela ukudibana kwemijelo emininzi. Lungisa ixesha lenaliti yevalvu ye-hot runner (impazamo ±5ms)

Ukuguqulwa kwamabala, ukudilika kwesakhiwo se-microstructure sokubumba okanye ukupholisha okungalinganiyo, ukuwelda kokulungiswa kwendawo + ukubumba umqadi we-ion (ubungakanani bokulungiswa yi-0.005mm)

Ukuqhekeka koxinzelelo, ukuthambeka okunganelanga kokudiliza (<1°) okanye isantya sokudiliza esikhawulezayo kakhulu, kwandisa inani leephini zokudiliza (1 kwi-100cm² nganye)

 

4. Amanqaku aphambili okuvelisa isikhunta ngenaliti:

Ukusebenza okubonakalayo kunye noyilo lwesakhiwo

Ukuhanjiswa kokukhanya kunye nolawulo lwendlela ebonakalayo

Ulwakhiwo oluphantsi komhlaba: Uyilo lwelensi yeFresnel yeNanoscale (ukuchaneka kobunzulu ±0.003mm), olufezekiswa ngeenkqubo zokugrumba nge-laser okanye nge-electroplating, nge-Angle ekhanyayo ye-≤15° kunye nokuphepha ukukhanya okukhanyayo (ixabiso le-UGR kufuneka libe <16);

Ukufana kobukhulu bodonga: I-algorithm yokwenza ngcono i-topological (i-ANSYS Discovery) iyasetyenziswa ukulinganisela ukuhanjiswa kokukhanya kunye nobunzulu. Ubukhulu bodonga buyi-1.2-2.5mm, kwaye ukunyamezela kulawulwa ngaphakathi kwe-±0.05mm. Imigca yokwahlula kunye namaqhinga okudiliza

Ukwahlulahlula okungalinganiyo: Kwiindawo ezigobileyo ezingalinganiyo (ezifana nezibane ezimile okwepetali), kusetyenziswa izilayidi ze-3D kunye neentonga zokudibanisa ezitsala i-hydraulic core. I-Angle ye-parting line offset yi-≤0.5° ukuqinisekisa ukuba akukho flash.

Ithambeka elidilikayo: Ithambeka lomphezulu obonakalayo ≥1.5°, kunye nethambeka lomphezulu ongabonakaliyo ≥0.8°. Inkqubo yokukhupha isebenzisa iiphini zokukhupha i-silicon nitride ceramic (i-friction coefficient <0.1).

 

Ukwenziwa ngcono kwezixhobo kunye nenkqubo ngokubambisana

Ukukhethwa kwesinyithi sokubumba

Intsimbi epholishwe kakhulu: I-S136 SUPREME (HRC 52-54) okanye iGerman Gritz 1.2085 ESR (epholishwe ngesipili ukuya kwiRa 0.008μm) iyathandwa;

Unyango olumelana nokugqwala: Umphezulu ugqunywe ngumaleko wekhabhoni efana nedayimani (i-DLC) (ubude obuyi-2-3μm), onokumelana neegesi ze-asidi eziveliswa kukubola kobushushu obuphezulu bePC.

Ukuba ufuna ukwenza ngokwezifiso isibane sePC esifanayo, ungaza kuthi. Singabelana ngemiba emininzi esiyenzileyo, okukuvumela ukuba ubone umgangatho wethu kwaye ufumane amava enkonzo yethu.


Ixesha leposi: Meyi-16-2025